This new AI XPU custom chip is likely to be used for AI training and could be manufactured on Taiwan Semiconductor Manufacturing Company's TSM 3nm node, he added. For the fiscal first quarter ...
Lightmatter, the leader in photonic (super)computing, today announced Passage™ L200, the world’s first 3D co-packaged optics (CPO) product. Designed to integrate with the latest XPU and switch silicon ...
Designed to integrate with the latest XPU and switch silicon designs ... This enables over 200 Tbps of total I/O bandwidth per chip package, resulting in up to 8X faster training time for advanced ...
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