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The new prototype accomplished functional operation with the high-speed PCIe 5.0 interface, which is twice the bandwidth of the previous PCIe 4.0 generation, via the combination of AIO Core's IOCore ...
The WE-SMTW 3258 HIGHTA is the third series of LEDs from the company, following WL-SMCW 0603 and WL-SMTD, that can withstand temperatures up to 100C. The 3.5mm × 2.8mm × 1.85mm LEDs are available in ...
The devices are entry-line 32-bit MCUs based on the Arm Cortex-M85 (CM85) core (360MHz/480MHz) with Helium and TrustZone, providing breakthrough performance (6.39 CoreMarks/MHz / 3000 CoreMarks @ ...
Diodes Incorporated has introduced its first automotive-compliant 3D linear Hall effect sensor. The AH4930Q detects the magnetic field in the X, Y, and Z directions, permitting reliable and ...
Nexperia has announced a new portfolio of high signal integrity, bidirectional ESD protection diodes in innovative flip-chip land-grid-array (FC-LGA) packaging. This new package technology is ...
To manage these challenges, the company unveils its new 64-bit Arm-based computers, created with a quad-core processor, reliable dual-wireless connectivity, simplified system software for easy ...
Allegro MicroSystems, Inc. has announced three new solutions to enhance motor control and thermal management performance in e-mobility and industrial automation applications. These new solutions, the ...
Smart manufacturing leverages data, connectivity, and automation to enhance flexibility, safety, and real-time performance.
Researchers at Washington University in Saint Louis have developed a biosensor that can detect airborne H5N1 avian influenza ...
Backlighting is ideal for models such as the company's SMART-PANEL, a slim and discreet wall-mount enclosure for building control systems, smart homes, offices, IoT/IIoT, measuring, healthcare, ...
RISC-V CPU from Alibaba powers China’s semiconductor shift, with the C930 chip targeting AI, cloud, and server markets.
As quantum computers become more complex with a larger number of qubits, the number of required interconnects also increases.
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